2026· IEEE Transactions on Aerospace and Electronic Systems· Vol 62, pp. 18091-18100· 0 citations· 36 references
TL;DR
This work introduces a 12-transistor nonvolatile radiation-hardened (12T-NVRH) SRAM cell in 28 nm CMOS that integrates spin-transfer torque-magnetic tunnel junctions with a self-recovering latch to achieve simultaneous nonvolatility and multinode resilience.
Abstract
In modern nanoscale technologies, static random-access memory (SRAMs) are increasingly vulnerable to radiation-induced soft errors, including single event upsets (SEUs) and double node upsets (DNUs), due to reduced critical charge (<inline-formula><tex-math notation="LaTeX">$Q_{\text{crit}}$</tex-math></inline-formula>) and aggressive device scaling. At the same time, conventional SRAM suffers from volatility and considerable standby power loss. This work introduces a 12-transistor nonvolatile radiation-hardened (12T-NVRH) SRAM cell in 28 nm CMOS that integrates spin-transfer torque-magnetic tunnel junctions) with a self-recovering latch to achieve simultaneous nonvolatility and multinode resilience. The proposed design exhibits an SVNM of 485.7 mV, a WTV of 414.3 mV, and a <inline-formula><tex-math notation="LaTeX">$Q_{\text{crit}}$</tex-math></inline-formula> of 38.9 fC, yielding the highest power-quality metric among benchmarked architectures. Performance and reliability metrics are validated through extensive simulations in 28-nm UMC technology node.
The binarized neural networks (BNNs) significantly reduce arithmetic and storage costs for edge inference, but repeated bitwise accumulation and memory access still limit system energy efficiency. This article presents leak-computing-in-memory (CIM), a <inline-formula> <tex-math notation="LaTeX">$256\times 64$ </tex-ma...
Hirotoshi Tagata, Takashi Sato, Hiromitsu Awano· IEEE Transactions on Very La...· 0 citations
This study presents the design and performance evaluation of a single-ended seven-transistor (7T) static random-access memory (SRAM) cell in 18 nm fin field-effect transistor (FinFET) technology for low-power, high-stability nanoscale very-large-scale integration (VLSI) applications. The cell combines separate read and...
Govinda M. R., Mallikarjun C. Sarsamba, S. Mathad· Journal of Computers, Mechan...· 0 citations
Within these limits, the proposed cell is a suitable candidate for last-level cache and embedded memory in area- and power-constrained mobile system-on-chip applications.
M. Govinda, Mallikarjun C. Sarsamba, S. Mathad· 165 citations· ⚡3
Magnetoresistive Random Access Memory (MRAM) technologies such as Spin-Transfer Torque (STT-MRAM) and Spin-Orbit Torque assisted (SOT-STT-MRAM) offer nonvolatility and low leakage, making them attractive for IoT systems. However, conventional MRAM read circuits face two fundamental challenges: high dynamic energy consu...
Wu Yang, Amit Degada, Himanshu Thapliyal· arXiv.org· 0 citations
Static Random Access Memory (SRAM) remains the dominant on-chip memory technology, occupying over 50% of chip area in modern microprocessors and serving as the backbone of cache hierarchies, register files, and AI accelerators (Evolution of SRAM Architectures, 2026). As CMOS technology scaling approaches fundamental ph...
Shivani Patel, Mrs. Deepali Sahu, Mr. Deepak Sahu· International Journal of Adv...· 0 citations
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