Flexible microheaters are critical components for localized thermal management in wearable and soft electronic systems; however, achieving efficient electrothermal performance while maintaining multifunctionality remains challenging. Here, we report geometry-engineered porous graphene microheaters fabricated through a single-step maskless laser writing process on polyimide substrates. Finite-element simulations and experimental investigations reveal that heater geometry plays a decisive role in governing current distribution and Joule heating behavior. In particular, smooth-cornered microheater architectures suppress current crowding, resulting in improved current uniformity, reduced resistive losses, and enhanced electrothermal performance. The optimized geometry achieves a maximum temperature of ∼117 °C at 5 V, compared to ∼87 °C for conventional sharp-cornered designs. Furthermore, optimization of laser processing conditions and metal-assisted fabrication produces highly conductive porous graphene with low defect density (ID/IG ≈ 0.24) and low sheet resistance (∼10 Ω sq–1), enabling rapid heating with a maximum ramp rate of ∼13 °C s–1. Beyond thermal actuation, the same device architecture functions as an intrinsic temperature sensor, exhibiting high linearity (R2 ≈ 0.99), a sensitivity of ∼0.069 % °C–1 over 30–100 °C, rapid response (∼2.1 s), and stable operation under repeated bending. The optimized porous graphene heater also demonstrates efficient deicing performance, achieving complete ice removal within ∼240 s with a heat flux of 115.6 mW cm–2 and an energy consumption of 27.7 J cm–2. These results establish geometry and process engineering as effective strategies for enhancing porous graphene microheater performance and provide a scalable platform for integrated thermal actuation and temperature monitoring in flexible electronic systems.
Precise microscale temperature sensing is important for evaluating the thermal reliability of microelectromechanical systems (MEMS), microfluidic devices, and other miniaturized systems. However, conventional lithography and vacuum-deposition-based fabrication methods are inherently limited in constructing freestandi...
Xuan Liao, Ming-Xuan Lv, Lin-Xiao Teng et al.· ACS Applied Electronic Mater...· 0 citations
High-entropy alloy nanoparticles (HEA-NPs) offer opportunities for multifunctional thermal conversion because of their multielement composition, tunable electronic structures, and metallic transport characteristics. However, their coupled photothermal-electrothermal behavior remains insufficiently explored, particularl...
Xiao-Yang Zhou, Kai Yin, Ling-Xiao Wang et al.· ACS Applied Materials and In...· 0 citations
Battery power loss, sluggish sensor response, and surface icing in low-temperature environments demand flexible and efficient thermal management materials. Here, we propose a flash-laser heating strategy to fabricate Sn single-atom anchored laser-induced graphene (Sn-SA@LIG) on a polyimide substrate. A secondary femtos...
Yu-Chun He, Kai Yin, Ling-Xiao Wang et al.· Nano letters (Print)· 0 citations
The escalating cooling demands of high‐heat‐flux electronic systems require materials that deliver efficient heat spreading, phase‐change enhancement, and scalable manufacturability—capabilities rarely found simultaneously on a single platform. Here, we introduce a microlaminate strategy that translates graphene's intr...
Arani Mukhopadhyay, Sungjoon Kim, Anish Pal et al.· Advanced Functional Material...· 0 citations
Gallium nitride (GaN) has established itself as a wide‐bandgap semiconductor, driving advances in radio‐frequency devices, solid‐state lighting, and high‐power electronics. Its chemical stability, strong piezoelectric properties, and biocompatibility have turned GaN into a crucial candidate for next‐generation microe...
Rizwana Bibi, Yang Li, Muhammad Farhan et al.· Laser & Photonics Review...· 0 citations
Traditional metal heat sinks are limited by moderate thermal conductivity, high density, and poor flexibility, which restrict their use in compact and lightweight electronics. Graphene films offer high in-plane thermal conductivity, but rapid reduction of graphene oxide (GO) releases gases from oxygen-containing groups...
Ning Li, Jian-Yin Miao, Jun-Hao Liu et al.· ACS Applied Materials and In...· 0 citations
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