Oct 2026· Coatings· Vol 16, pp. 1213· 0 citations· 39 references
Abstract
Thermal interface materials (TIMs) are indispensable in electronic thermal management, as they mitigate interfacial thermal resistance and improve heat transport efficiency between adjacent components. A major factor hindering the thermal performance of conventional TIMs is the substantial interfacial thermal resistance arising at the interfaces between non-continuous fillers and the polymer matrix. To overcome this limitation, this study develops a continuously oriented TIM using a monolithic pyrolytic graphite film (PGF) combined with film-coating and hot-pressing processes. A polyurethane layer is coated onto PGF films, which are stacked and hot-pressed into a dense composite block. Sectioning the block perpendicular to the pressing direction yields a PGF/PU TIM. The material delivers a thermal conductivity of 118.5 W/(m·K) and demonstrates superior heat dissipation behavior under practical testing conditions. Through the establishment of continuous heat transfer pathways, this strategy alleviates interfacial resistance at filler–matrix interfaces and provides both theoretical basis and technical routes for high-power-density electronic packaging applications.
The increasing power densities of artificial intelligence and high-performance computing (HPC) chips place stringent demands on thermal interface materials (TIMs), which are designed to combine efficient heat transport with interfacial conformability, stress relaxation, and long-term reliability. Conventional silicone-...
Thermal interface materials used in high-power electronic devices must combine efficient heat transfer with mechanical flexibility and suitable thermal stability. However, constructing continuous in-plane and through-plane heat-conduction pathways at low filler loadings while preserving mechanical properties remains ch...
Guo-Jun Cheng, Ming Yan, Ya-Ling Zhang et al.· Coatings· 0 citations
The continuous advancement in the integration density of microelectronic devices, as well as the development of high‐frequency devices in the background of green energy, has drawn increasing attention to the issue of heat dissipation. Taking IGBTs as an example, although higher power density can improve the output el...
As artificial intelligence (AI) and high-density chip packaging continue to advance, increasing power densities in electronic devices are intensifying localized heat accumulation, making high-performance thermal interface materials (TIMs) increasingly important for efficient heat dissipation and device reliability. P...
Yu-Cheng Jiang, Jian-Hui Zeng, Long-Feng Zou et al.· ACS Applied Polymer Material...· 0 citations
Localized heat accumulation in electronic devices degrades performance, safety, and cycle life. Phase change materials (PCMs) have been widely investigated for passive thermal regulation; however, conventional core–shell encapsulated PCMs often exhibit limited effective heat absorption because shell materials remain...
Junho Kim, Min Park, Sangwoo Kim et al.· ACS Applied Energy Materials· 0 citations
The escalating power density of electronics demands thermal interface materials (TIMs) that simultaneously offer high thermal conductivity, strong adhesion, and environmental sustainability. Conventional thermally conductive adhesives (TCAs) face inherent trade-offs among these properties, often relying on non-recyclab...
Shui-Chang Chen, Yu-Chen Zhang, Yue-Jiang Lin et al.· ACS Applied Materials and In...· 0 citations
We use cookies to run the site and, with your consent, for analytics and to show ads.
See our Cookie Policy.
