Aug 2026· Journal of Science and Transport Technology· pp. 126-139· 0 citations· 25 references
Abstract
The article investigates the cooling process of the Ga0.8In0.2 semiconductor alloy over the cryogenic temperature range (T) from 300 K to T = 4 K using molecular dynamics (MD) simulations. The structural characteristics are analyzed through the radial distribution function (RDF), including the Ga–In bond length (rGa−In), the peak height of g(r), the total system energy (Etot), and the system size (L). At T = 300 K, the alloy exhibited a predominantly face-centered cubic (FCC) local structure with rGa−In = 3.15 Å, g(r) = 5.56, L = 4.95 nm and Etot = -16,032 eV. Upon cooling to 169 K and 90 K, the system undergoes a more ordered structural rearrangement, reflected in a decrease of Etot from –16,032 eV to –16,142 eV, an increase of g(r) to 6.22, and a slight reduction in L. At T = 77 K, the alloy reaches Etot = –16,154 eV with g(r) = 6.56, corresponding to a continued decrease in total energy during the ordering process. Finally, at T = 4 K, the system approaches an almost frozen state, with a pronounced drop in Etot to –16,202 eV and a sharp increase in g(r) to 7.87, indicating enhanced local atomic ordering. Nevertheless, the decrease in Etot is insufficient to drive full crystallization, which provides quantitative insight into temperature-driven structural ordering within the predominantly FCC phase at cryogenic temperatures. These results provide a theoretical basis for experimental investigations of Ga–In semiconductor alloys in the low-temperature regime and offer valuable guidance for potential applications in electronic and semiconductor devices.
Highlights The activation energy of the nucleation, growth and stable crystallization processes calculated for AMA Al87Y4Gd1Ni8 equals to 193 ± 12, 199 ± 30, and 188 ± 18 kJ/mol and the frequency factor (k0) equals to 2.0 × 1012, 3.53 × 1013, and 4.41 × 1011 s −1, respectively. It has been established that during isoth...
K. Khrushchyk, P. Świec, Yu. O. Kulyk et al.· Materials· 0 citations
Molecular Dynamics is used to simulate displacement damage in GaN and In0.25Ga0.75N materials. To investigate the effects of energy and temperature on defect evolution, the collision cascades are simulated under different PKA energies (2-10 keV) and temperatures (100-900 K). The impacts of energy and temperature on the...
Xinghan Gu, Xing-Chuan Cai· Journal of Physics, Conferen...· 0 citations
In this study, molecular dynamics simulations were used to examine glass formation in equiatomic Ni.Mn alloy across system sizes of 4000–16384 atoms, cooling rates of 5×10
12
–10
14
K s
–1
, and isothermal annealing at 600, 700, and 800 K. Increasing the model size improves the statistical sampling of local str...
Mai Van Dung· International Journal of Mod...· 0 citations
To identify resilient materials for nuclear reactors, DFT calculations were systematically performed to observe the structural, phonon, mechanical, anisotropic elastic, electronic, thermophysical, and optical properties of tetragonal M2O3 (M = Zr, Hf). The structural parameters and c/a ratio show good agreement with ex...
M. Islam, A. I. Ahmed, M. A. R. Sheikh et al.· Journal of scientific resear...· 0 citations
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