Aug 2026· Journal of Artificial Intelligence General science (JAIGS) ISSN:3006-4023· Vol 10, pp. 61-77· 0 citations· 41 references
TL;DR
In general, physics-based informed intelligence and adaptive AM create a promising basis for reliable, efficient, traceable, and environmentally friendly high-performance engineering.
Abstract
Physics-informed machine learning, digital twins, and additive manufacturing are a new direction for the creation of intelligent, adaptive, and high-performance engineering systems that are being integrated into a smart industrial framework. The strategy combines multimodal sensing, data fusion, physics-based modeling, machine learning, process optimization, and closed-loop control, and addresses the challenges of enhancing manufacturing performance across the product life cycle. In physics-informed machine learning, physics principles are incorporated into the data-driven models, which enhances prediction accuracy, decreases the need for large data sets, and facilitates generalization from model to model for different process conditions. Digital twins are virtual models of AM systems that support real-time monitoring and anomaly detection, predictive analysis, virtual experiments, and adaptive process control. The combination of edge computing and intelligent controllers enhances quick decision-making processes during the fabrication process. Aerospace, defense, biomedical engineering, and advanced composite manufacturing are just a few of the applications that show promise for achieving better dimensional accuracy, defect reduction, lightweight design, energy efficiency, material utilization, and process traceability. Industrial deployment is, however, hindered by the lack of high-quality datasets, class imbalance, limited model transferability, interoperability, high computational requirements, cybersecurity, certification, and lifecycle governance. For scalable implementation, standardized data formats, open architectures, benchmark datasets, federated learning, hybrid modeling, and rigorous validation procedures are all important. In general, physics-based informed intelligence and adaptive AM create a promising basis for reliable, efficient, traceable, and environmentally friendly high-performance engineering.
The integrated architectural approach is able to link manufacturing at the physical level with the sensing, data infrastructure, physics-based modelling, surrogate modelling, artificial intelligence, and closed-loop control levels, and puts the emphasis on the remaining need for physics-based knowledge, transparent decision making, human supervision, and validated control architectures.
M. Uddin, Sumi Ghosh· Journal of Computer Science...· 0 citations
Ten contributions are brought together to demonstrate how the systematic integration of physical knowledge can enhance model robustness, reduce data requirements, and improve generalization across manufacturing applications.
Jiewu Leng, Hui Yang, Min Xia et al.· Journal of Computing and Inf...· 0 citations
This article delves deep into the confluence of simulation, ML, and statistics, showcasing how they synergize to improve engineering workflows and emphasizes that DCE is not just a technological advancement but a foundational strategy for next-generation engineering solutions.
Benjamin Scott· International Journal of Dat...· 0 citations
Key performance indicators, including production efficiency, resource utilization, product quality, energy efficiency, downtime reduction, and system reliability, demonstrate the effectiveness of the proposed Digital Twins framework.
Suresh Babu Reddy· International Journal of App...· 0 citations
This paper proposes an advanced 5D digital twin framework specifically designed for intelligent manufacturing scenarios with nonlinear, high-dimensional process dynamic characteristics. By systematically integrating geometric, temporal, physical, behavioral, and probabilistic dimensions, the proposed system extends the traditional digital twin paradigm, enabling it to comprehensively and accurately model complex manufacturing environments. Embedding physical priors and real-time probabilistic reasoning, as well as cross-domain data fusion, adaptive data preprocessing, and high-frequency industrial sensor networks—particularly LSTM-based simulation modules—constitute this architecture. To achieve interaction and monitoring, a modular visualization interface was developed. Supports dynamic process analysis, anomaly localization, and intuitive operator involvement. In the actual thermal management tasks of battery production lines, experimental validation shows that compared to traditional digital twin configurations, the 5D method improves prediction accuracy, shortens anomaly detection intervals, and enhances operational usability. This framework provides quantifiable performance metrics for benchmarking complex system behavior and supports multimodal input streams. The results highlight the 5D framework's capabilities in achieving smart manufacturing, including unifying heterogeneous industrial data sources, driving high-fidelity simulations, and providing actionable visual analytics. This comprehensive strategy makes the system more transparent, scalable, and robust.
Weijuan Leng· International Conference on...· 0 citations
Semiconductor manufacturing is becoming increasingly complex due to the continuous scaling of device dimensions, stringent quality requirements, and the demand for high production efficiency. Traditional manufacturing approaches often face challenges related to process variability, equipment failures, defect detection, and yield optimization, limiting their ability to meet the requirements of next-generation integrated circuits. Artificial Intelligence (AI) has emerged as a transformative technology that enables intelligent automation, predictive analytics, and real-time decision-making throughout semiconductor fabrication processes. This paper presents an AI-driven semiconductor manufacturing framework that integrates machine learning, deep learning, computer vision, edge computing, Industrial Internet of Things (IIoT), and digital twin technologies to enhance wafer fabrication, process monitoring, equipment maintenance, and quality inspection. The proposed framework employs deep neural networks for defect classification, reinforcement learning for adaptive process optimization, predictive maintenance models for equipment health monitoring, and digital twins for virtual process simulation and continuous optimization. Furthermore, AI-enabled analytics facilitate anomaly detection, resource allocation, and production scheduling while reducing manufacturing costs and energy consumption. The integration of explainable AI techniques improves transparency and supports informed decision-making in high-precision fabrication environments. The proposed approach is expected to improve manufacturing yield, reduce defect rates, minimize equipment downtime, optimize resource utilization, and enhance overall production efficiency, thereby supporting the development of intelligent, resilient, and sustainable semiconductor manufacturing systems aligned with Industry 4.0 and smart factory initiatives.
Bandla Hansika, Medipelli Aravind, N. Swaroop· International Journal of Sci...· 0 citations
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