Comprehensive TIM Coverage Analysis on Lidded Flip Chip Package Using SAM and Digital Microscopy
Abstract
Numerous publications and technical papers have investigated thermal interface materials (TIMs) and the optimized use of TIMs and heat sinks for thermal management in integrated circuit (IC). Several of these studies employ scanning acoustic microscopy (SAM), which is widely recognized as a highly effective, non-destructive technique for characterizing material interfaces in semiconductor packages. SAM is now one of the most commonly used analytical tools in semiconductor packaging and assembly. This paper presents methods for evaluating TIM within the package using C-mode scanning acoustic microscopy (C-SAM), including the use of built-in analytical software tools to quantify uncovered die areas and delamination following environmental stress testing. A digital microscope is subsequently used to verify the physical condition of the TIM after de-lidding the package and performing a package cross-section one of the samples. The described methodology for in-package TIM analysis can support improved TIM selection and optimization of related manufacturing processes.
