Stress effects on grain boundary grooving in polycrystalline interconnects: Insights from phase-field simulations
We develop a multi-phase-field framework to investigate stress-modulated grain boundary grooving in polycrystalline metal interconnects. Larché–Cahn stress-diffusion coupling is incorporated into the surface-diffusion-driven morphological evolution equations, enabling concurrent simulation of free-surface grooving and...
Shui-Bao Liang, Han Jiang, Z. Zhong et al.
· Journal of Applied Physics · 0 citations