A few-shot learning framework using multimodal rheological features for local prepreg thickness prediction in multilayer PCBs
As multilayer printed circuit boards (PCBs) move toward high-frequency and high-speed applications, back-drilling stub control and impedance matching have become critical for signal integrity. Their accuracy is strongly governed by the micrometer-level stability of prepreg (PP) dielectric thickness during lamination. H...
Zhen Zhang, Xin Huang, DengSuRong Cai et al.
· Advanced Engineering Informa... · 0 citations