Author

Xin Wu

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Review Open access Oct 2026

Toward Intelligent Chemical Mechanical Polishing: Integrating Multiscale Modeling and Machine Learning

A closed-loop CMP ecosystem—linking materials innovation, mechanistic understanding, in situ sensing, and intelligent optimization—may support the next generation of high-efficiency, green, and manufacturable planarization technologies.

Xin Wu, Quan-Zhou Yao · Materials · 0 citations