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Si-Ying He

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Open access Oct 2026

Conversion-Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip-Level Thermal Management.

The increasing power densities of artificial intelligence and high-performance computing (HPC) chips place stringent demands on thermal interface materials (TIMs), which are designed to combine efficient heat transport with interfacial conformability, stress relaxation, and long-term reliability. Conventional silicone-...

Long-Feng Zou, Yu-Cheng Jiang, Tao-Ying Rao et al. · 0 citations

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