Sustainable Thermoplastic Thermal Interface Adhesive Derived from Poly(lipoic acid) and Boron Nitride for Efficient Electronic Thermal Management.
The escalating power density of electronics demands thermal interface materials (TIMs) that simultaneously offer high thermal conductivity, strong adhesion, and environmental sustainability. Conventional thermally conductive adhesives (TCAs) face inherent trade-offs among these properties, often relying on non-recyclab...