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Sponsored AI Networking Cookbook: Practical recipes for AI-assisted network automation and development AI Networking Cookbook: Practical recipes for AI-assisted network automation and development

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Long-Feng Zou

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Open access Oct 2026

Poly(Ionic Liquid) Composites with Liquid Metal–Copper Hybrid Networks for High-Performance Thermal Interface Materials

As artificial intelligence (AI) and high-density chip packaging continue to advance, increasing power densities in electronic devices are intensifying localized heat accumulation, making high-performance thermal interface materials (TIMs) increasingly important for efficient heat dissipation and device reliability. P...

Yu-Cheng Jiang, Jian-Hui Zeng, Long-Feng Zou et al. · 0 citations
Open access Oct 2026

Conversion-Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip-Level Thermal Management.

The increasing power densities of artificial intelligence and high-performance computing (HPC) chips place stringent demands on thermal interface materials (TIMs), which are designed to combine efficient heat transport with interfacial conformability, stress relaxation, and long-term reliability. Conventional silicone-...

Long-Feng Zou, Yu-Cheng Jiang, Tao-Ying Rao et al. · 0 citations

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