Hua-Tao Wang

The Design of Filler Morphology and Orientation: Two Pivotal Strategies for the Optimization of Thermal Transport in Thermal Interface Materials

The continuous advancement in the integration density of microelectronic devices, as well as the development of high‐frequency devices in the background of green energy, has drawn increasing attention to the issue of heat dissipation. Taking IGBTs as an example, although higher power density can improve the output el...