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Author

Hao Wang

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Aug 2026

Sucrose-Assisted Interface Engineering of Boron Nitride for BT-Based High-Frequency Electronic Packaging Substrates with Low Dielectric Loss and Enhanced Thermal Conductivity.

The rapid evolution of high-frequency communication, heterogeneous integration, and high-power-density packaging technologies has imposed increasingly stringent requirements for low-loss signal transmission and efficient heat dissipation on polymer-based packaging substrates. Herein, a BN interfacial engineering strate...

Hao Wang, Yu-Xin He, Kang Luo et al. · 0 citations

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