Preprint
Aug 2026
200 mm Wafer-Scale Monolithic 3D Integration of Atomic Layer-Deposited Oxide Semiconductors
Monolithic 3D (M3D) integration offers a pathway to overcome the scaling limits of conventional silicon complementary metal-oxide-semiconductor (CMOS) technology by extending dense vertical stacking of multifunctional logic and memory devices. Here, we demonstrate wafer-scale M3D integration of three tiers of atomic-la...
Chang Niu, Lin-Jia Long, Lu-Qi Zheng et al.
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