Microstructure‐Resolved Modeling and Prediction of Thermal Conductivity in PA6 /Ag Nanocomposites via SEM ‐Based RVE Reconstruction and Finite Element Analysis
Efficient thermal management is increasingly critical for polymer‐based components used in compact electronic and semiconductor devices. Here, we develop an integrated experimental‐computational framework to quantify and predict heat‐transfer behavior in polyamide‐6/silver (PA6/Ag) nanocomposites. Silver nanopartic...